Equipment Utilization Chart- October 2013
600
500
Total hrs
400
300
200
100
0
Total
pecvdpecvdnon
office
office
hrs
hrs
DrieDrienon
office
office
hrs
hrs
rie flrie flnon
office
office
hrs
hrs
rie clrie clnon
office
office
hrs
hrs
sputte
sputte
r 1r 1non
office
office
hrs
hrs
180 540
180 540
180 540
180 540
180 540
sputte
sputte
r2r 2non
office
office
hrs
hrs
EEbeam
beam
evptrevptrnonoffice
office
hrs
hrs
CPD CPD non
office
office
hrs
hrs
180 540
180 540
180 540
Unavailable
0
180
0
180
0
180
0
180
0
180
0
180
Downtime
0
0
18
15
0
0
0
0
0
0
0
0
4
180
Not Used
102 354
123 343
120 354
132 358
Used
78
39
60
48
6
2
6
2
176 180
Therm
Therm
al
al
Evapor
Evapor
atoratornon
office
office
hrs
hrs
RFAnelvaEquip
Sputte1- non
ring- office
office hrs
hrs
0
180 540
0
180 540
36 180
0
180
26 180
20 180
0
25
21
0
0
0
0
0
164 332
18 324
60 324
36 360
52 340
16
126 36
95
118
108 20
28
15
0
250
Equipment Utilization Chart- Comparison- July-Oct-2013
PECVD
DRIE
RIE-Fl
RIE-Cl
Sputter
Coater1
Sputter
Coater2
Total hrs
200
E-beam
Evaporator
CPD
150
100
50
0
Total
July Aug Sep Oct
July Aug Sep Oct
July Aug Sep Oct
July Aug Sep Oct
July Aug Sep Oct
July Aug Sep Oct
July Aug Sep Oct
July Aug Sep Oct
180 180 180 180
180 180 180 180
180 180 180 180
180 180 180 180
180 180 180 180
180 180 180 180
180 180 180 180
180 180 180 180
Unavailable 0
0
0
0
0
0
0
0
0
0
0
0
0
Downtime
0 10 3
0
0
2 21 18
Not Used
82 132 88 102
94 137 108 123
0
0 139 120
Used
98 38 89 78
86 41 51 39
3
0 39 60
0
0
0
0
0
0
0
177 180 2
0
4 25 2
0
0
0
4
92 122 119 132
36 80 4
84 33 59 48
144 100 172 176
0
0
0
0
0
0
0 36
0
0
0
0
128 180 4 24
0
0
0
0
0
0 25
4
48 0 160 140
117 108 96 18
105 129 129 60
4
63 72 84 126
75 51 51 95
0 16 16
0
0
RF-Anelva Sputtering
Thermal Evaporator
200
Total No. of hours
180
160
140
120
100
80
60
40
20
0
July
Total
184
Maintenance 32
Downtime
0
Not Used
60
Used
92
Aug
168
32
0
60
76
Sep
160
32
0
16
112
Oct
148
26
0
4
118
July
184
32
0
64
88
Aug
168
32
0
48
88
Sep
160
28
0
36
96
Oct
148
20
8
12
108
1. CPD tool:
•
•
First half yearly AMC was carried out in the month of OCT 2013.
Chiller problem is solved and is working
2. TECPORT E-Beam Evaporation tool:
The TECPORT Engineers visit:
•
•
•
•
•
•
PLC program and software modification was done for 6 hearth.
Issues with sweep controller for E-Gun 2 was fixed.
Encounter of several glitches in the operation of IC6 was fixed.
The Engineers educated the staff on how to change the E-Gun filaments and how to
control the electron beam manually.
The leak in view port shutter Assembly was fixed.
Leak near mass flow controller was fixed.
WORK NEED TO BE DONE FROM TECPORT’s END:
• To extend the O2 lines near to the substrate holders, to maintain the film stoichiometry.
• Tools for measurement of Ion gun Parameters: TECPORT to quote.
Sputter tools:
• Heaters and Crystal assembly is dismantled .
Dry Etch– Tool status Update Oct 2013
• PECVD
– Doped (diborane) and undoped amorphous silicon deposition
– SiGe and SiC optimization in progress. Material characterization and
stress measurement study
• RIE
– SiGe etch optimization with C4F8, O2 ; CF4, N2
• DRIE
– SPTS intervention
• new solenoid valve on the return line of the ICP RF generator,
• grounding Capacitor to drain the LF generator power after process and supporting
brackets for the transformer in the control cabinet
torr
E-Beam Evaporations pump down characteristics.
100
19th July 2013
17th July 2013
Sep-12
10th Oct 2012
15th Oct 2012
May-13
Sep-13
18th Oct 2013
10
1
0.1
0.01
1E-3
1E-4
1E-5
1E-6
0
50
100
150
Time (min)
200
250
torr
1E-4
19th July 2013
17th July 2013
Sep-12
10th Oct 2012
15th Oct 2012
May-13
Sep-13
18th Oct 2013
1E-5
1E-6
0
50
100
150
Time (min)
200
250
Thickness in nm
Thickness in nm
Thickness in nm
E-Beam Evaporations
METALS
1. Chromium.
2. Gold.
3. Aluminum.
4. Nickel.
5. Hafnium.
6. Titanium.
OXIDES:
1. Al2O3.
2. SiO2.
3. TiO2.
4. ITO.