NNfC monthly
admin committee meeting
Dry Etch and Thin films
&
Process Integration
August 26, 2014
Tool issues
• eBeam deposition:


Down time due to e-gun arching and single operational gun. Two
new electron guns installed on August 13th.
Most commonly used materials qualified on 15cc crucibles to
more efficiently use target. Previously all depositions, including
Gold was being done on 25cc crucibles.
• Sputter tools:


Sputter2 down for mid-July to early August due to WindowsXP
boot-up and PC system. Issue resolved with help from Smart
Systems.
New deposition requests denied:


Special targets such as TaN and TiW not available.
Thick Al2O3 (100nm) requiring long deposition times.
2
Tool issues
• DRIE:



SPTS local support has been discontinued, causing longer
down times and slow recovery.
System not fully operational after conversion to 4-inch chuck.
System is now working with limited capability –




only HF bias (13.56MHz) recipes qualified.
Seeing excessive polymer deposition on LF (350KHz) bias
recipes.
Troubleshooting on-going with phone and email support from
Singapore.
Need to accelerate PM schedule – parts being ordered for first
major PM in two years … Target Nov ‘14.
3
Equipment Utilization Chart- August 2014
600
500
Total hrs
400
300
200
100
0
Total
pecvdpecvdnon
office
office
hrs
hrs
DrieDrienon
office
office
hrs
hrs
rie flrie flnon
office
office
hrs
hrs
rie clrie clnon
office
office
hrs
hrs
sputtersputter
1- 1- non
office office
hrs hrs
sputtersputter
2- 2 - non
office office
hrs hrs
E-beam
E-beam
evptrevptrnonoffice
office
hrs
hrs
180 540
180 540
180 540
180 540
180 540
180 540
180 540
RFAnelvaEquip
Sputteri1- non
ng- office
office hrs
hrs
Therma
Therma
l
l
Evapor
Evapor
atoratornon
office
office
hrs
hrs
180 540
180 540
Unavailable
0
180
0
180
0
180
0
180
0
180
0
180
0
180
0
180
0
180
Downtime
0
0
72
99
0
0
0
0
0
32
16
50
52
114
0
0
0
0
7
210
113 287
28
246
4
344
28
348
51
100
0
176
16
152
12
Not Used
136 349
93
261
Used
44
15
0
11
122 359
145 356
58
35
1
4
173 118
23
Equipment Utilization Chart- Comparison
200
Sputter
Coater1
Sputter
Coater2
E-beam
Evaporator
Anelva
Sputter
Thermal
Evap.
PECVD
DRIE
RIE-Fl
RIE-Cl
Ma
JunJulyAug
y
Ma
JunJulyAug
y
Ma
JunJulyAug
y
Ma
JunJulyAug
y
Ma
JunJulyAug
y
Ma
JunJulyAug
y
Ma
JunJulyAug
y
Ma
JunJulyAug
y
Ma
JunJulyAug
y
18 18 18 18
18 18 18 18
18 18 18 18
18 18 18 18
18 18 18 18
18 18 18 18
18 18 18 18
18 18 18 18
18 18 18 18
Unavailable 0 0 0 0
0 0 0 0
0 0 0 0
0 0 0 0
0 0 0 0
0 0 0 0
0 0 0 0
0 0 0 0
0 0 0 0
180
160
Total hrs
140
120
100
80
60
40
20
0
Total
Downtime
12 1 4 0
3 83 27 72
7 6 0 0
8 0 4 0
0 0 0 0
18 40 14 16
32 0 12 52
0 0 0 0
8 0 0 0
Not Used
73 99 86 13
11 50 12 93
10 13 12 12
11 12 12 14
0 37 0 7
0 10 11 11
52 28 12 28
12 16 8 4
36 48 32 28
Used
95 80 90 44
62 47 30 15
69 37 58 58
62 58 50 35
18 14 18 17
0 31 21 51
96 15 15 10
16 16 17 17
13 13 14 15
MTRDC project progress
• Unit process development started in Aug.
– Key challenges in eChannel RIE, Au-seed layer, gold plating,
wafer bonding and dicing.
• Prasiddhi mask ordered to start structural learning.
Sadanand Deshpande, NNFC
6