Equipment Utilization Chart- February 2014
600
500
Total hrs
400
300
200
100
0
Total
pecvdpecvdnon
office
office
hrs
hrs
DrieDrienon
office
office
hrs
hrs
rie flrie flnon
office
office
hrs
hrs
rie clrie clnon
office
office
hrs
hrs
sputte
sputte
r 1r 1non
office
office
hrs
hrs
180 540
180 540
180 540
180 540
180 540
sputte
sputte
r2r 2non
office
office
hrs
hrs
EEbeam
beam
evptrevptrnonoffice
office
hrs
hrs
180 540
180 540
CPD CPD non
office
office
hrs
hrs
RFAnelvaEquip
Sputte1- non
ring- office
office hrs
hrs
Therm
Therm
al
al
Evapor
Evapor
atoratornon
office
office
hrs
hrs
180 540
180 540
180 540
Unavailable
0
180
0
180
0
180
0
180
0
180
0
180
0
180
0
180
0
180
0
180
Downtime
0
0
2
0
0
0
0
0
0
0
0
0
16
12
35
22
0
0
0
0
0
196
Not Used
110 358
146 356
123 350
154 358
Used
70
32
57
26
2
4
10
2
180 164
128 336
72 308
114 336
28 360
36 352
52
92
31
152
144
24
40
2
0
8
Equipment Utilization Chart- Comparison
200
Sputter
Coater1
Sputter E-beam
Coater2 Evaporator
Anelva
Sputter
Thermal
Evap.
No De
Fe
Jan
v c
b
No De
Fe
Jan
v c
b
No De
Fe
Jan
v c
b
18 18 18 18
18 18 18 18
18 18 18 18 0 18 18 18 18
0 40 0 0
0 45 0 0
0 0 0 0
PECVD
DRIE
RIE-Fl
No De
Fe
Jan
v c
b
No De
Fe
Jan
v c
b
No De
Fe
Jan
v c
b
No De
Fe
Jan
v c
b
No De
Fe
Jan
v c
b
No De
Fe
Jan
v c
b
No De
Fe
Jan
v c
b
18 18 18 18
18 18 18 18
18 18 18 18
18 18 18 18
18 18 18 18
18 18 18 18
Unavailable 0 45 0 0
0 45 0 0
0 45 0 0
0 45 0 0
0 40 0 0
0 40 0 0
RIE-Cl
180
CPD
160
Total hrs
140
120
100
80
60
40
20
0
Total
0 0 0 0
Downtime 84 11 2 0
2 6 0 2
1 0 0 0
1 8 0 0
0 4 0 0
8 4 0 0
0 0 8 16
0 25 77 35
0 0 0 0
0 0 0 0
Not Used
82 21 10 11
14 90 15 14
13 88 14 12
16 10 14 15
0 0 4 0
14 11 12 12
84 64 68 72
93 78 85 11
64 96 60 28
84 10 76 36
Used
14 0 76 70
34 39 27 32
47 47 37 57
17 23 32 26
18 13 17 18
32 20 52 52
96 76 10 92
87 32 18 31
11 84 12 15
96 80 10 14
• DRIE
Dry Etch– Tool status Update Feb 2014
– Load lock O-Ring changed . Ordered for new set.
– Wafer transport issue – robot arm aligned.
– Process: scallop smoothening trials in progress
•
•
•
•
DRIE deep etches with S-Type wafer – scallops
FGA anneals @1000DegC show no effect
Scallop etch in RIE
SEM imaging and process tuning in progress
• RIE
– Scallops smoothening
• Combined process with DRIE.
• using Anisotropic Si etch (RIE) smoothening scallops.
• Result – scallop reduced to 145nm from 1.3 µm.
• Trials for deeper etch and scallop size to be done.
Reduced scallop
– SiO2 plastering
• Trench filling by PECVD SiO2 , followed by RIE SiO2 etch.
• Work in progress for better conformal deposition.
• PECVD
vacuum leak in load lock –VAT valve to arrive tomorrow!
Process is done in manual mode
SiO2 plastering
Technical Note