NNfC monthly
admin committee meeting
Dry Etch and Thin films bay
Oct, 7th, 2014
Tool issues
• DRIE update:
• September 11th-18th  extensive process work done
(~45 samples) to re-qualify the tool for the 4-inch
chuck.
• SPTS does not have much experience with 4-inch escchuck machines (all 4-inch tools use a mechanical
clamp).
• All five base recipes were significantly modified.
• Continue to have profile issue with high etch rate
recipe (>25um/min).
 Need to replace the coil RF feed through (damaged in June ‘14).
 High etch rate recipe requires high coil power … currently limited to
3500W due to damaged part … to be replaced during AMC.
2
September 17th, 2014
Process B HF (>25um/min recipe) profile needs improvement – Pressure sensor samples
Center
edge
edge
edge
Uniformity optimization – Sept 18th, 2014
Process A HF 6-7um/min @ 30C
1
3min30sec
2
3
Etch depth =27.7/29.37/29.7/29.3/27.55um
Mean=28.7um
Etch rate=8.2um/min (>300um feature)
Unif. = 3.74%
4
5
Process A LF 3-4um/min 1:1@30C
1
2
3
4
5
Etch time = 6 mins
Etch depth =23.3/25.9/26.5/25.3/23.1 um
Mean= 24.8um
Etch rate=4.95 um/min (>300um feature)
Unif. = 6.8%
Tool issues
• eBeam deposition:
• Both guns no operational. Most of the depositions
qualified on 15cc crucible.
• Gold consumption continues to be a challenge ...
starting September we will be charging users for
precious metal usage – Au, Pd, Pt, Ag
e.g. 200nm gold consumes ~ 3.5g of gold !!
• Changing policy for depositions >150nm need
approval (Twiki updated).
• Sputter tools:
• No issues in September.
5
25
E-BEAM EVAPORATION Au USAGE CHART AS OF
30th Sep 2014.
Weight in grams.
20
15
10
5
0
Feb: Mar: Apr: May: Jun: Jul: Aug: Sep: Oct: Nov: Dec: Jan: Feb: Mar: Apr: May: Jun: July: Aug: Sep:
2013 2013 2013 2013 2013 2013 2013 2013 2013 2013 2013 2014 2014 2014 2014 2014 2014 2014 2014 2014
Borrowed from RD (g)
15.12419.994
Given to RD (g)
Used for depositions (g) 1.05 1.797
5.183
1.6
2.24
1.2
16.03814.876
5.001
0.181
0
6.885 1.483 1.901 8.244 7.959 6.134 7.614 7.605 3.195 17.82319.792 9.1 23.721
Equipment Utilization Chart- Office hours
200
Sputter
Coater1
Sputter
Coater2
E-beam
Evaporator
Anelva
Sputter
Thermal
Evap.
PECVD
DRIE
RIE-Fl
RIE-Cl
JunJulyAugSep
JunJulyAugSep
JunJulyAugSep
JunJulyAugSep
JunJulyAugSep
JunJulyAugSep
JunJulyAugSep
JunJulyAugSep
JunJulyAugSep
18 18 18 18
18 18 18 18
18 18 18 18
18 18 18 18
18 18 18 18
18 18 18 18
18 18 18 18
18 18 18 18
18 18 18 18
Unavailable 0 0 0 0
0 0 0 0
0 0 0 0
0 0 0 0
0 0 0
0 0 0 0
0 0 0 0
0 0 0 0
0 0 0 0
Downtime
1 4 0 0
83 27 72 54
6 0 0 0
0 4 0 12
0 0 0 16
40 14 16 0
0 12 52 0
0 0 0 0
0 0 0 0
Not Used
99 86 13 78
50 12 93 63
13 12 12 11
12 12 14 11
37 0 7 29
10 11 11 11
28 12 28 16
16 8 4 24
48 32 28 36
Used
80 90 44 10
47 30 15 63
37 58 58 70
58 50 35 56
14 18 17 13
31 21 51 62
15 15 10 16
16 17 17 15
13 14 15 14
180
160
Total hrs
140
120
100
80
60
40
20
0
Total
Equipment Utilization Chart- September 2014
600
500
Total hrs
400
300
200
100
0
Total
pecvdpecvdnon
office
office
hrs
hrs
DrieDrienon
office
office
hrs
hrs
rie flrie flnon
office
office
hrs
hrs
rie clrie clnon
office
office
hrs
hrs
sputtersputter
1- 1- non
office office
hrs hrs
sputtersputter
2- 2 - non
office office
hrs hrs
E-beam
E-beam
evptrevptrnonoffice
office
hrs
hrs
180 540
180 540
180 540
180 540
180 540
180 540
180 540
RFAnelvaEquip
Sputteri1- non
ng- office
office hrs
hrs
Therma
Therma
l
l
Evapor
Evapor
atoratornon
office
office
hrs
hrs
180 540
180 540
Unavailable
0
180
0
180
0
180
0
180
0
180
0
180
0
180
0
180
0
180
Downtime
0
0
54
0
0
0
12
0
16
80
0
0
0
0
0
0
0
0
Not Used
78
348
63
345
110 354
112 348
29
167
118 345
16
336
24
346
36
342
Used
102
12
63
15
70
56
135 113
62
164
24
156
14
144
18
6
12
15
MTRDC project progress
• Unit process development started in Aug.
– Key challenges in eChannel RIE, Au-seed layer, gold plating, wafer
bonding and dicing.
• Direct write one one wafer to start structural learning.
Sadanand Deshpande, NNFC
9
Thank you !