o
IBL
Insertable B-Layer
ATLAS Italia / Referee
Roma, July 14th 2010
G. Darbo – C. Meroni
INFN / GE – MI
On behalf of INFN IBL
Agenda:
http://indico.cern.ch/conferenceDisplay.py?confId=100499
G. Darbo – INFN / Genova
ATLAS Italia / CSN1 Referee – IBL
Roma, 14 June 2010
Outline
Status of the IBL project
• With focus on INFN related activities
Status of the Technical Design Report (TDR)
• Schedule
• Consolidation of the Physics & Performance case for IBL
Interim-Memorandum of Understanding
• Cost, resources, sharing
Richieste finanziarie e attività 2011
G. Darbo – INFN / Genova
ATLAS Italia / CSN1 Referee – IBL
Roma, 14 July 2010
2
IBL Detector
Material
Raphael/Neal
The
present from
7 m long
section of the beam-pipe will be cut
(flange too big to pass inside the existing pixel) and
extracted in situ.
The new beam-pipe with the IBL inserted at its place.
PP1 Collar
Sealing
service ring
Alignment
wirers
IBL Specs / Params
IST
IBL Support
Tube
IBL Staves
G. Darbo – INFN / Genova
ATLAS Italia / CSN1 Referee – IBL
14 staves, <R> = 33.25 mm.
CO2 cooling, T < 15ºC @ 0.2 W/cm2
X/X0 < 1.5 % (B-layer is 2.7 %)
50 µm x 250 µm pixels
1.8º overlap in ϕ, <2% gaps in Z
32/16 single/double FE-I4 modules
per stave
• Radiation dose 5x1015 neq/cm2
•
•
•
•
•
•
Roma, 14 July 2010
3
LHC Plans & IBL Milestones
LHC plans (ATLAS “interpretation”)
•
•
•
•
Have a phase I and II
Phase I when 30÷50 fb-1
Accumulate 300÷400 fb-1 on phase I
Agreed with CERN management to
have phase I shutdown in 2016
(unofficial yet).
IBL design specification (Lint, L)
•
•
Life dose @ integrated of 500 fb-1
R/O: peak L=3x1034 @ LVL1=100kHZ
IBL Milestones
•
•
•
•
•
•
•
•
FEI4 submission : 6/2010.
sensor choice 6/2011.
FEI4 Version 2 eng. Run 9/2011.
first prod module 11/2012
last prod module 9/2013.
Stave loading completed (incl. 3 months cont) 6/2014
End of integration (incl. 3 months cont) 5/2015
IBL installation 5/2015 – early 2015 Installation possible,
but no contingency.
LHC
Ref. M. Nessi
G. Darbo – INFN / Genova
ATLAS Italia / CSN1 Referee – IBL
Roma, 14 July 2010
4
FE-I4 (GE)
60 KGD / Wafer
16 Wafers
FE-I4 submitted on July 1st at 14:00 (GMT)
•
•
•
•
More than 2 years of engineering work for a team of >15 Engineers/physicist
Largest HEP chip ever 20.2x19.0 mm2, 87 million transistors!
IBM accepted all the waivers, tomorrow the WRB at IBM will discuss the waivers and tell us the risk.
Fabrication time is 10-12 weeks. An expected delivery date will be provided 1-2 weeks after
submission. 60 Known Good Dies / wafer.
Money contributions collected following
interim-MoU share.
• Engineering run cost > 500kCH
• 16 8-inch wafer expected
20.2 mm
FE-I4 FINAL LAYOUT
87M TRANSISTORS!
Engineering Team:
At Bonn Tomasz Hemperek, Michael Karagounis, and Andre
Kruth; at CPPM Denis Fougeron, Fabrice Gensolen, and Mohsine
Menouni; at Genova Roberto Beccherle; at LBNL Julien Fleury
(visiting from LAL), Dario Gnani, and Abderrezak Mekkaoui; and
at NIKHEF Vladimir Gromov, Ruud Kluit, Jan David Schipper, and
Vladimir Zivkovic.
Students:
David Arutinov (Bonn), Bob Zheng and Frank Jensen (LBNL)
Physicists:
Marlon Barbero, Maurice Garcia-Sciveres
19.0 mm
G. Darbo – INFN / Genova
ATLAS Italia / CSN1 Referee – IBL
Roma, 14 July 2010
5
Module Prototype Program & Test Beam (GE, PI, TN, UD)
Sensors and IBL activities merging
• Test beam coordination & analysis between IBL and Sensor R&D
• EUDET telescope used by Planar, 3D and Diamond sensors: 3 µm resolution!
• Common order and plans for FE-I4 prototype modules, bump-bonding at IZM.
• INFN contribution to the cost: 9k€
• GE, TN and UD focusing on 3D, PI part of the planar prototyping
• Once sensor technology will be decided, INFN will contribute to production
IBL
G. Darbo – INFN / Genova
3D Sensors
GE, TN, UD
ATLAS Collaborations
for sLHC R&D
Test beam Coordination
within IBL WG1
Residual from EUDET extrapolation to
50µm pitch pixels (single hit clusters).
FBK-Irradiated 3E sensors (*)
Flat top:
High telescope
resolution
ATLAS Italia / CSN1 Referee – IBL
50µm
Roma, 14 July 2010
6
3D Sensor – Recent results(*)
Lorentz Angle @ B = 1.6 T)
3D sensors from FBK irradiated to
1015 – 5 x 1015 neq/cm2
• Karlsruhe: 26 MeV protons
• Ljubljana: reactor neutrons
Planar: ΘL = -7.4º ± 0.4
3D: ΘL = 0º
Lab & Test Beam measurements (*)
• Very good efficiency at 80 V @ 1015
neq/cm2 (preliminary)
Not full 3D devices…
• Full 3D in development at FBK
Angle = 0º
Angle = 15º
(*)
- Eff. = 99.0%
p-irradiated devices (dose = 1015 neq/cm2)
- Eff. = 99.9%
Credits: June 2010 beam and lab tests name list
M. Borri, M. Boscardin, L. Bosisio, V. Cindro, G.F. Dalla Betta, G. Darbo, C.
Da Via, B. DeWilde, Su Dong, C. Gallrapp, C. Gemme, H. Gjersdal, P.
Grenier, S. Grinstein, P. Hansson F. Hugging, A. La Rosa, A. Micelli, C.
Nellist, S. Parker, H. Pernegger, O. Rohne, A. Rovani, K. Sjobaek, K.
Tsiskaidze, J. Janssen, J.W. Tsung, N. Wermes.
G. Darbo – INFN / Genova
ATLAS Italia / CSN1 Referee – IBL
Roma, 14 July 2010
7
FBK – 3D Sensors for IBL
IBL Design (slim and active edge):
• 3D sensor with slim edge (200µm) and full
through columns. DRIE (Deep Reaction
Ionizing Etching) is stopped by a 0.7µm
membrane. In process 200 and 230 µm thick
wafer batches. Expected wafers Oct.2010
• Active edge, with support wafer. Wafer end of
the year.
• Wafer floorplan has 8xFE-I4, 9xFE-I3, CMS, ...
Planar Sensor
3D Sensor
FBK 3D wafer for IBL
700nm DRIE
stopping
membrane
G. Darbo – INFN / Genova
ATLAS Italia / CSN1 Referee – IBL
FBK DRIE:
200÷230 µm x 12µm
Roma, 14 July 2010
8
Indium Bump Bonding (MI, GE)
Indium BB at Selex (technology option, SiAg
at IZM baseline)
X-ray of FE-I4 size dummy
bumped to dummy sensor
• Selex qualified for small FE-I3 need to change
the process to FE-I4
• First attempt with dummy was partially
succesfuls
• Need to upgrade the flip-chip head and
change pressure/temperature of the process
• Test with scan chains -> with FE-I4 if
successful.
164 Pixels shorted
Dummy sensor
Dummy FE
8 Pixels shorted
6 Pixels shorted
4 Pixels shorted
G. Darbo – INFN / Genova
ATLAS Italia / CSN1 Referee – IBL
Roma, 14 July 2010
9
ROD (BO + GE)
Redesign the ROD (Read-out Driver) architecture starting from the Pixel
design:
• Reason: components obsolescence, bottle neck of the Architecture,
complexity in debugging due to mixed DSP / FPGA environment.
Smart Idea:
• Move the embedded processing used for calibration (4 DSP/Board) to
standard PC: use
GB-ethernet
Responsibilities:
• BO the ROD board,
FPGA, PowerPC
Programming
• GE electrical-BOC to
connect to FE-I4
modules without
opto-link (debug the
initial system)
G. Darbo – INFN / Genova
INFN responsibility
ATLAS Italia / CSN1 Referee – IBL
Roma, 14 July 2010
10
Flex Hybrid Design (GE)
Stave flex (technology / test
demonstrator)
Simulation of transmission:
CLK/DT-IN (40 MHz, multipoint)
• Final layout made at GE submitted to
CERN PCB workshop: in production
• 5 Cu layers and 1 Al layer (for LV)
• Total thickness = 0.45mm
• (Designed) Impedance = 80Ohm
Several additional designs
• Single layer module flex, test boards,
• Simulation of the full chain
undergoing at GE
Simulation of transmission:
DT-OUT (160 Mbps, multipoint)
Wing
EOS
G. Darbo – INFN / Genova
Bus (10mm wide)
ATLAS Italia / CSN1 Referee – IBL
Roma, 14 July 2010
11
PP2 Redesign (MI)
IBL needs new Power Distribution System:
• Increase of current per channel worst case (up to ~ 4A)
• Solution: use two LDO (low drop outputs) / channel with current limit
PP2 Crate
Controller board
• to improve the existing design (new FPGA)
• Collaboration between Milano and Barcellona
• FPGA: same ACTEL family but need to qualify
for radiation tolerance
Regulator Board
Controller Board
G. Darbo – INFN / Genova
ATLAS Italia / CSN1 Referee – IBL
Roma, 14 July 2010
12
Stave Design (MI)
STAVE CARACTERISTICS
SIMULATION RESULTS
Pipe
ID/OD
[mm]
Omega
Thickness
[µm]
Foam
Density
[g/cm3]
Coolant
CF pipe, heavy foam
2.4 / 3.0
150
0.55
CF pipe, light foam
2.4 / 3.0
150
Ti 3mm pipe, light foam
2.8 / 3.0
Ti 2mm pipe, light foam
2.0 / 2.2
X/X0 [%]
Thermal
Figure of
Merit (Γ)
[ºC•cm2/W]
Bare Stave
with
Coolant
Full layer
(+ Module
+ Flex)
C3F8
0.48
1.056
17.25
0.25
CO2
0.36
0.956
18.56
300
0.25
C3F8
0.66
1.276
2.79
300
0.25
CO2
0.57
1.166
3.22
Baseline
Design baseline defined:
• Ti cooling pipe with CO2 cooling.
Prototyping and test
• Many prototypes made
• Status: finalizing base line design
• Major technical contributions from MI and
~1/3 of the project under financial
responsibility of INFN
G. Darbo – INFN / Genova
ATLAS Italia / CSN1 Referee – IBL
Roma, 14 July 2010
13
IBL Technical Design Report Status
TDR
G. Darbo – INFN / Genova
ATLAS Italia / CSN1 Referee – IBL
Roma, 14 July 2010
14
TDR: Status & Schedule
Motivation for delay in TDR printout:
IBL (Staves)
• LHC machine plans after Chamonix, luminosity
profile, machine shut-downs impacted on IBL
TDR.
Need of better documentation of Physics
performance for the TDR  ATLAS EB 
Ed Moise
"IBL physics and performance taskforce”
(M. Elsing, A. Andreazza)
• The TF will reinforce the efforts to ensure the
completion of the IBL performance studies for the IBL
TDR by end of August.
Existing B-layer
TDR draft (Schedule)
• First draft circulated to selected readers,
comments received, being implemented.
• Second review by experts: mid July.
• TDR draft ready for distribution to IBL
Collaboration: 2nd week of August
• Final TDR ready: 4th week of August
• Submission to LHCC: 1st week of September
G. Darbo – INFN / Genova
IBL in the Physics Simulation & in
the Engineering CAD Rendering
ATLAS Italia / CSN1 Referee – IBL
Iourii Gusakov
IBL (Staves)
Roma, 14 July 2010
15
Physics & Performance TF
consolidate and extend present studies
•
•
•
•
single particle performance (pions and muons)
tracks in jets (100 and 500 GeV di-jets, top, WH)
primary vertexing with high lumi. Pileup
b-tagging, especially redo high-pt jets studies
study different pileup scenarios
• zero, 1034, 2*1034 and 3*1034 luminosity
• estimate efficiency and fake rate vs lumi
• demonstrate how IBL helps for robust tracking in jets, with fakes, …
add emulation of Pixel/SCT readout problems
• study robustness of tracking and how IBL recovers performance
Status
• IBL geometry existing, motecarlo production ongoing
• Checking results on single tracks, tuning jets and vertexing
• TDR editing… keep deadline!!!
G. Darbo – INFN / Genova
ATLAS Italia / CSN1 Referee – IBL
Roma, 14 July 2010
16
IBL Performance (TF Results)
Simulation shows:
• Clear improvement in impact parameter
resolution (plot 1)
• Specially in the region pT<10 GeV, that
in ATLAS is dominated by multiple
scattering
• 50% improvement of rejection power in btagging (plot 2)
• Performance are stable even if existing blayer is off (plot 3).
Plot 1
(top events)
Plot 1
Light jets rej.
Plot 3
IP resol.
G. Darbo – INFN / Genova
ATLAS Italia / CSN1 Referee – IBL
Roma, 14 July 2010
17
Interim-Memorandum of Understanding
MOU
G. Darbo – INFN / Genova
ATLAS Italia / CSN1 Referee – IBL
Roma, 14 July 2010
18
Memorandum of Understanding
IBL Memorandum of Understanding (MoU)
• Between The ATLAS COLLABORATION, and Funding Agencies/Institutions of
the ATLAS Collaboration constructing the IBL (for the ATLAS construction was
between Institutes and CERN).
• The MoU comprises all of the actions needed to construct and commission the
IBL. The operation and maintenance of IBL is not a part of the present MoU and will
be included, following its completion, within the M&O MoU framework. (IBL once
delivered will be part of the Pixel Detector)
• Annexes define: work sharing and responsibility, cost contribution, project
organization and management structure.
IBL interim MoU – Why an interim MoU?
• Ad Interim MoU until sensor technology is chosen (Planar Silicon / 3D Silicon /
Diamond) - Decision on sensor technology (Spring 2011) – Sensor R&D and IBL
communities work in tight collaboration to finalise a design matching IBL specification.
• Consolidate interest of Institutes and availability of funds
G. Darbo – INFN / Genova
ATLAS Italia / CSN1 Referee – IBL
Roma, 14 July 2010
19
Development of Interim-MoU
IBL (interim)-MoU Status:
• “IBL Kick-off” meeting (8/7/2009)
• Institutes express their interest in the IBL based on project WBS (Workpackage Breakdown
Structure).
• Institute Board created with the Institutes interested in the project
• Extended Pixel IB (Meetings: 1/03/2010 and 18/06/2010)
• Defined sharing of work, cost amongst Institutes/Funding Agencies (i-MoU annexes)
• All project is covered by resources – need x-check with Funding Agencies (FA)
• Status
• Collecting feedback from FA on funding and general project support
• Going to sign the interim-MoU?
INFN (BO, GE, MI, UD)
• Quite active in the project, very good synergy and collaboration keeps up INFN visibility.
G. Darbo – INFN / Genova
ATLAS Italia / CSN1 Referee – IBL
Roma, 14 July 2010
20
Institutes and Contributions to IBL
Technology options refer
to supplementary costs
that are sensor
technology specific and
will be known before the
definite MoU takes effect.
42 Institutes in the interimMoU (few others are
“observers” ).
14 Countries + CERN
9.7 MCH total project cost
Note: the numbers in the
table "are not final, nor are
the suggested financial
contributions yet firm, but
are meant for a common
overall discussion.”
G. Darbo – INFN / Genova
ATLAS Italia / CSN1 Referee – IBL
Roma, 14 July 2010
21
INFN Contribution to IBL
Total IBL cost:
• 9741 kCH
Total INFN contribution:
• 1400 kCH (14.4 %)
• 1047 kCH CORE
• 354 kCH M&O-A in-kind
~100 kCH presently on
M&O-A could be deducted
from INFN if cables
(assigned as work
responsibility) becomes inkind contribution.
G. Darbo – INFN / Genova
ATLAS Italia / CSN1 Referee – IBL
Roma, 14 July 2010
22
INFN Contribution to MoU Items
Resources and deliverables are
summarized in the two tables
G. Darbo – INFN / Genova
ATLAS Italia / CSN1 Referee – IBL
Roma, 14 July 2010
23
2011 – Programma attività INFN, richieste finanziarie,
responsabilità, milestones
RICHIESTE FINANZIARIE
G. Darbo – INFN / Genova
ATLAS Italia / CSN1 Referee – IBL
Roma, 14 July 2010
24
BOLOGNA
Attività 2011:
• Sviluppo PCB prototipo ROD.
• Sviluppo firmware FPGA e software PowerPC del ROD
• porting software da DSP (old Pixel ROD) a PowerPC
• Test bench per sviluppo software TDAQ del ROD (Crate e Single Board
Computer – SBC)
G. Darbo – INFN / Genova
ATLAS Italia / CSN1 Referee – IBL
Roma, 14 July 2010
25
GENOVA
Attività 2011
• Sviluppo prototipo funzionale Flex Hybrid per lo stave e per il modulo
• Disegno versione 2 del FE-I4 (sottomissione Autunno 2011)
• Catena alta tensione: Test della catena completa di alta tensione con PS, cavi a PP1,
Flex hybrid, sensore
• Si sta discutendo di installare I cavi nell Shut Down 2012/13 – sono su M&O-A,
potrebbero essere presi in-kind (stima ~40÷50 kCH).
• Sviluppo prototipo & test dei moduli: in vista della produzione (2012) del 50% del totale
• Sviluppo scheda BOC (back of crate card) elettrico per leggere moduli con ROD senza
opto-link (per QC RoD, test-beam, system test, produzione moduli…). In
collaborazione con BO e gruppi tedeschi (BOC)
G. Darbo – INFN / Genova
ATLAS Italia / CSN1 Referee – IBL
Roma, 14 July 2010
26
MILANO
Attività Milano 2011:
• Prototipaggio e preproduzione stave
• Modifiche schede regolatori PP2 (differenti specifiche FE-I4: VDD , IDD ),
scheda controller PP2 (nuova FPGA da qualificare con irraggiamento),
backplane
• Sviluppo bump-bonding con Selex (alternativa technologica alla IZM)
G. Darbo – INFN / Genova
ATLAS Italia / CSN1 Referee – IBL
Roma, 14 July 2010
27
TRENTO (Dot.1 PD)
Attività 2011:
• Simulazione sensori in 2 D e 3D
• layout sensori 3D (slim e active edge), layout maschere bump-bonding
• Test strutture su wafer sensori 3D: prima e dopo irraggiamenti
G. Darbo – INFN / Genova
ATLAS Italia / CSN1 Referee – IBL
Roma, 14 July 2010
28
UDINE
Attività 2011:
•
•
•
•
Sviluppo sensori 3D insieme a UD e TN (fase di prototipaggio),
Bump-bonding di FE-I4 con sensori 3D
Test-beam, irraggiamenti sensori 3D
Pre-produzione sensori (tecnologia da decidere a metà 2011)
G. Darbo – INFN / Genova
ATLAS Italia / CSN1 Referee – IBL
Roma, 14 July 2010
29
Sommario Richieste e Responsabilità IBL
Responsabilità nel progetto IBL:
• Giovanni Darbo:
IBL Project Leader
L1
https://twiki.cern.ch/twiki/bin/view/Atlas/InnerDetectorOrganisation
• Danilo Giugni
Stave WG Coordinator
L2
https://espace.cern.ch/atlas-ibl/Shared%20Documents/IBL_Organization.v1.2.pdf
G. Darbo – INFN / Genova
ATLAS Italia / CSN1 Referee – IBL
Roma, 14 July 2010
30
Milestones INFN
Milestones – ATLAS IBL:
• IBL -Test beam di rivelatori con chip FE-I4
30/4
• IBL - Scelta baseline per i sensori
31/7
• BL - produzione e test prototipo ROD/BOC
31/10
G. Darbo – INFN / Genova
ATLAS Italia / CSN1 Referee – IBL
Roma, 14 July 2010
31
Conclusions
IBL planned to be completed by 2015
• CERN/Experiments agree on a shutdown in 2016
TDR is progressing and documenting the technical design of the IBL
• Deadline for submission to LHCC early September
iMoU ready to sign
• Some Countries/Institutes already did.
INFN balanced between money contribution and visibility of activities, but
• Competition is high … and many want a seat on boat!
G. Darbo – INFN / Genova
ATLAS Italia / CSN1 Referee – IBL
Roma, 14 July 2010
32
BACKUP SLIDES
G. Darbo – INFN / Genova
ATLAS Italia / CSN1 Referee – IBL
Roma, 14 July 2010
33
IBL Project Status in Pills
All the aspect of the IBL project are pretty well covered:
• Some in advanced design or prototype phase, as mentioned sensor and FE-I4
Just to mention a few
• Stave: baseline CO2 cooling & Ti-pipe, TM measurements & FEA simulation well on its
way.
• Stave/module flex-hybrid: multi-layer and stacked single layer prototyping.
• Internal services: design, simulation, prototyping
• Off-detector R/O: architecture defined, detailing board design and firmware
• Power chain: upgrade study of the PP2 regulator. Simulation & design, waiting FE-I4
for selecting power scheme. Sensor decision impacts HV selection.
• Integration in SR1, installation mockup in bld. 180: designs, prototypes, getting parts
• Stave loading: ideas, testing, looking at jigs
• Layout: global supports, beam-pipe flanges, IST
• 2012 shutdown: preparatory activities in the pit for IBL
• Installation: guiding pipe, insertion/extraction table, ALARA
• Cooling: cooling plant parameters, TM studies and prototypes for beam-pipe bakeout
For most updated overview checkout June IBL Workshop at hold Geneva Univ.:
• http://indico.cern.ch/conferenceTimeTable.py?confId=93635#20100616.detailed
G. Darbo – INFN / Genova
ATLAS Italia / CSN1 Referee – IBL
Roma, 14 July 2010
34
IBL Layout
Baseline layout decided
• 14 Staves, “reverse
turbine” (there were two
main options in Barcelona)
Beam-pipe reduction:
• Inner R: 29  25 mm
Very tight clearance:
• “Hermetic” to straight tracks
in Φ (1.8º overlap)
• No overlap in Z: minimize
gap between sensor active
area.
Layout parameters:
•
•
•
•
•
IBL envelope: 9 mm in R
14 staves.
<R> = 33 mm.
Z = 60 cm (active length).
η = 2.5 coverage.
G. Darbo – INFN / Genova
ATLAS Italia / CSN1 Referee – IBL
Roma, 14 July 2010
35
Extraction/Insertion
Progresses on many areas:
•
•
•
•
•
•
Installation mock-up (Geneva & CERN ) in bld 180
Extraction/Insertion “table” (LPSC Grenoble)
Long Guiding Tube (Brandeis)
Integration and Envelopes definition (CERN Atlas TC)
Beam-pipe split flanges (CERN Vacuum group)
ALARA (CERN Atlas TC)
G. Darbo – INFN / Genova
ATLAS Italia / CSN1 Referee – IBL
Installation
Mock-up in bld.180
Roma, 14 July 2010
36
IBL TDR
Editors: M.Capeans (CERN), K. Einsweiler (LBNL)
Chapter Editors: G.Darbo, T.Flick, M.Garcia-Sciveres, C.Gemme, H.Pernegger, O.Rohne, R.Vuillermet
and quite many Contributors to different chapters: A.Andreazza, O.Beltramello, A.Catinaccio, I.Dawson, D.Ferrere,
KK.Gan, D.Giugni, Y.Gousakov, N.Hartman, I.Hinchliffe, F. Huegging, S.Kersten, N.Massol, P.Morettini, D.Muenstermann,
L.Nicolas, M.Raymond, S.Rozanov, D.Su, W.Trischuk, C.da Via, E.Vigeolas and S.Wenig
Chapters’ Structure:
1. Overview – IBL history, lifetime and failure issues, requirements, physics
2. Modules – sensors (3 technologies), FE electronics, integration (bump-bonding, “mini- Flex”)
3. Staves - mechanical concept for the stave, module loading, cooling and thermal issues, electrical
integration, internal services
4. Integration - mounting staves with beampipe, services integration, final surface testing
5. Control, Readout, and Integration - power supplies, opto-links, off-detector readout electronics,
external services, cooling plant, DCS, integration with the present detector DAQ/DCS
6. Installation – beampipe extraction, mock-up, IBL transport and installation, connection and testing
7. Commissioning – calibration, early data-taking plan with random triggers, charge injection, cosmic ray
data-taking
8. Prototyping, Production Testing, System Testing
9. Critical Integration Issues – cooling, bakeout, powering, detector weight, material budget
10. Project Management and Organization
Draft has 200 pages (too long?).
Circulated to selected readers (many comments received):
Attilio Andreazza, Andrea Catinaccio, Allan, Nigel Hessey, Tim Jones , Leonardo Rossi, Steinar Stapnes,
Georg Viehhauser, Norbert Wermes
G. Darbo – INFN / Genova
ATLAS Italia / CSN1 Referee – IBL
Roma, 14 July 2010
37