Fairchild Smart Power Modules
Motion-SPM
Marco Farneti
Field Application Engineer
September 2007
www.fairchildsemi.com
Think Future First
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Fondata nel 1968, azienda privata
Terzo distributore a livello mondiale con un
faturatto globale di 3B$.
Opera in 167 regioni in 41 paesi con più di
5,000 impiegati a livello mondiale
Il più alto livello di stock disponibile nel
mercato.
Servizi Logistici customizzati
Presente in Italia da 11 anni con una
strutura che conta 65 persone distribuite
nelle zone più strategiche.
Forti investimenti sulla nostra struttura di
Demand Creation che oggi conta 15
persone, di cui 11 sono ingegneri, per un
completo supporto tecnico al cliente.
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Outline
• Introduction of Motion-SPM
• Application Examples
• Typical Application Circuit
Input Stage of Gate Driver
Short-circuit Endurance
• How to find an adequate SPM?
Loss Calculation, Thermal Calculation,
System Reliability ( Power Cycling)
• Design Tool SPM
• Motion Control Lab FFB
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Introduction of
Motion-SPM
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Smart Power Modules SPM™
SPM™ Family (Motion SPM)
1,200
WW SAM
1,000
Inverter-controlled variable speed
drive for 3 phase induction motor
used for inverter type home
appliances and industrial inverter
$842M in CY 07
[$M]
800
Inverter and Servo < 10kW
600
400
Industrial market
200
0
1996
1997
1998
1999
2000
2001
2002
2003
2004
2005
2006
2007
2008
2009
Applications:
Appliances
 Washing Machine
 Air Conditioner
 Dishwasher
 Vacuum-cleaner
 Heat-pumps
 Fans
 …
Industrial
 AC-Drives
 Servo-Drives
 Welding
 UPS
 Photovoltaic
 …
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Smart Power Modules SPM™
- reduced total system cost
SPM’s built-in HVIC and
LVIC with protection
circuit
- reduced development time
- easy management
- optimized control flexibility
- higher reliability
- higher efficiency
- improved time to market
SPM, which
integrates all diverse
components,
enhances
productivity while
simplifying
manufacturing
SPM optimizes driving
characteristics for builtin power devices
BOM cost
Impact of using SPM on…
Reduced number of components
High performance
Increased reliability
Less board space or application volume
Easier and faster design
Reproducible performance
System
cost
Time to
market
0h failures
Failures in
time
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0
0
0
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0
0
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Fairchild Smart Power Modules SPM™
-Available PackagesDIP Package
DIP Package
ceramic based
DBC based
New Type
MiniDIP
Package
fully
molded
TinyDIP
Package
transfer
molded
MiniDIP
Package
ceramic
based
Mini DIP
Package
DBC
based
SMD
version
TinyDIP
with larger
creepage
distances
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Fairchild Smart Power Modules SPM™
-DIP Line Up- Inverter Application
Types:
(22) VB(W)
(21) VCC(WH)
(20) IN(WH)
FSAM10SM60A
FSAM15SM60A
FSAM20SM60A
FSAM30SM60A
(23) VS(W)
(18) VB(V)
(17) VCC(VH)
(16) COM(H)
(15) IN(VH)
(19) VS(V)
(13) VB(U)
(12) VCC(UH)
FSAM10SH60A
FSAM15SH60A
FSAM20SH60A
FSAM30SH60A
(11) IN(UH)
(14) VS(U)
VCC
COM
IN
OUT
W (31)
VS
VB
VCC
COM
IN
OUT
VS
V (30)
VB
VCC
COM
IN
 Ceramic substrate
OUT
U (29)
VS
(10) RSC
(9) CSC
(8) CFOD
(7) VFO
(6) COM(L)
(5) IN(WL)
(4) IN(VL)
(3) IN(UL)
(2) COM(L)
Current rating @ Tc = 25 °C
SH => switching frequency 15 kHz
SM => switching frequency 5 kHz
Voltage rating
P (32)
VB
(1) VCC(L)
 2500 V Isolation
Voltage
C(SC) OUT(WL)
C(FOD)
NW (28)
VFO
 Divided dc-link
terminals
IN(WL) OUT(VL)
IN(VL)
NV (27)
 Built in thermistor
IN(UL)
COM(L)
OUT(UL)
VCC
NU (26)
 Adjustable current
protection
VTH (24)
THERMISTOR
RTH (25)
 60 mm x 31 mm
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Fairchild Smart Power Modules SPM™
-TinyDIP Line Up- Inverter Application
Types:
FSB50250
FSB50450
FSB50325
Types:
FSB50250S
FSB50450S
FSB50325S
 Transfer Molded
 Small size
 1500 V Isolation
Voltage
 Optimized EMI
 29 mm x 12 mm
Voltage rating
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Application Examples
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5
Application Example - Washing Machines
SPM5
Drying Fan
SPM3
Motor
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Application Example - Air Conditioners
SPM5
FAN Motor
PFC-SPM
SPM3
Compressor
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Application Example - Refrigerators
AC Input
SPM3
CONTROL BOARD
or
SPM4
Evaporator
Fan Motor
Compressor Motor
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Typical Application Circuit
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Typical Application Circuit
Bias Voltage
SPM
Microcontroller
High Side
Load
DC link
Voltage
Low Side
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Typical Application Circuit
SPM
Microcontroller
Active High Interface
• Direct connection with controller
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Input Stage of Gate Driver
DIP
FSAMxx
Active Low
Mini-DIP
FSBSxx
FSBBxx
FCBSxx
Active High
Tiny-DIP/SMD
FSB50450
Active High
HS: Rpull-up=1.0MOhm
LS: Rpull-up=0.1MOhm
Rpull-down=3.3kOhm
Rpull-down=3.3kOhm
Rpull-down=3.3kOhm
Rpull-down=500kOhm
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Bootstrap Circuit
Bootstrap Circuit
• Adjustable high-side switching speed
• Reduce noise / EMI
• Provides supply (13.5-16.5V) to HVICs
• Single-grounded power supply
• Optocoupler-less interface
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SPM Protection
Further protection: OTP by thermistor
e.g. SPM DIP
• Controlling of Vcc (UVLO)
to drive the gates correctly
to reduce Ploss
SPM
Under Voltage Lock Out
Protection
Over Current Protection
Fault Signal Output
only LVIC
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Short-circuit Endurance
Start condition:
Transistor is turned on to an existing load short circuit.
Vin
[5V/div.]
Max. current ≈
8~10 x rated current
Min. current due to
temperature up
Ic
Withstanding
time
IGBT:
4us
MOSFET:
20us
All SPM modules contain Short Circuit Protection with exception of FSB5xx.
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How to find an adequate SPM?
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Hints for the Power Stage
The following slides will focus on three-phase Drive applications:
Block diagram of an AC-Drive
Calculations for a proper
module selection:
 Loss calculation
 Thermal calculation
 Lifetime calculation
Three phase basic Inverter topology
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3phase Inverter Topologic
Currents and voltages of a
standard Inverter topology
based on a PWM modulation
Motor phase current
Motor phase to phase
voltage
IGBT current
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How to find an adequate SPM?
Loss Calculation
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Loss calculation basics
PlossInverter
6 PlossIGBT
6 PlossDiode
IGBTs as well as Diodes have non linear characteristics
Exact calculation can be done by
a numeric calculation using Simulation programs
Good approximation can be done by linearization of the device characteristics.
Important definitions:
 Linearization
 Modulation index
 Cos (Phi)
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How to find an adequate SPM?
Thermal Calculation
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Thermal limits
Definitions:

Rth: Thermal resistance [K/W] or [°C/W]

Rthjc: Thermal resistance junction to case [K/W] or [°C/W]

Zth: Transient thermal impedance [K/W] or [°C/W]

Zthjc: Transient thermal impedance junction to case [K/W] or [°C/W]

Tj: Junction temperature [°C]

Tc: Case temperature [°C]

Ptot: maximum Power losses [W]
Zth
T (t )
; Rth
P
T (t
,d
Zthjc
Tjc(t )
Ptot
Tj (t ) Tc(t )
Ptot
Rthjc
Tjc
Ptot
Tj Tc
Ptot
1)
P
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Thermal limits
Zth
T (t )
; Rth
P
T (t
,d
1)
P
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Thermal limits
Zthjc @ 5Hz 1.0
Zthjc @ 50 Hz
C
W
0 .8
C
W
Example:
Tj 150 C; Tc 100 C
P max
Tjc
Zthjc
P max@( f 0
f0
50 Hz )
50 C
C
0.8
W
62.5W
50 Hz
1
f0
P max@( f 0
20ms
5Hz )
f0
5Hz
50 C
C
1.0
W
1
f0
200ms
50W
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Thermal limits
Average Junction temperature (Tj avg)
Tj = f(t) @ 5Hz output frequency
Tj = f(t) @ 50 Hz output frequency
This behavior is important for the Power Device selection
The startup procedure of a drive begins at low output frequencies
Irms max for AC-Drives are typically 1.5 to 2 times of the nominal current.
Irms max for Servo Drives are often rated up to 3 times of the nominal current.
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How to find an adequate SPM?
System Reliability
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Power Cycling Capability
What is Power Cycling?
A well known method to estimate the lifetime of an electronic device.
The measurement and calculation of Power Cycling curves is very complex.
Failure criteria is a electrical value
(e.g. Vce sat) which can increase
due to internal mechanical
changes based on different
thermal expansion coefficients.
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Power Cycling Capability
A ΔTj lower than 30°C is negligible.
for AC-Drives with a fixed output
frequency the numbers of switch on
and switch off cycles are important.
Example:
Tc=75°C
Tj max @ full load = 150°C
Δ Tj for an on/off cycle is 75°C.
For Δ Tj=75°C it’s possible to drive
105 cycles.
Typical Power-Cycling Curve
Assumed this Drive will be switched on and off 5 times a day the lifetime can be
calculated as follows:
5
Lifetime [ years ]
10
54.79 years
365 5
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Power Cycling Curves SPM-Modules
Initial Tj is 25°C.
Measured points: Tj = 50°C, 90°C and 120°C
25°C is initial and 75°C after power cycling (On time)
25°C is initial and 115°C after power cycling (On time)
25°C is initial and 145°C after power cycling (On time)
Confidential
0.1 % of tested modules failed (Vcesat out of spec.)
1 % of tested modules failed (Vcesat out of spec.)
10 % of tested modules failed (Vcesat out of spec.)
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Power Cycling
FSBB20CH60
FSBB30CH60
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Design Tool
Smart Power Module
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Design Tool SPM
http://www.fairchildsemi.com/spm
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Design Tool SPM
Fast and rough approximation of power dissipation
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Design Tool SPM
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Motion Control Lab
Fuerstenfeldbruck
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Motion Control Lab FFB
Why:
- To strengthen the support for our costumer
- To find solution together with our costumer
Current Activities:
- Build-up test equipment to measure TJ
- Thermal management (SPM5)
- Test of module behavior
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REMEMBER
TO
ALWAYS…
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