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HV-CMOS Hybridization
G. Darbo – INFN / Genova
Future Pixel Chip Design – Vidyo 18 Mar 2014
On Behalf of Genova ATLAS Pixel
& Genova Low Temperature Detector (LTD) Lab
Indico agenda:
https://indico.cern.ch/event/289724/
G. Darbo – INFN / Genova
HV-CMOS – FE-I4 Hybridization
18 March 2014
How to Glue HV2FEI4 to FE-I4
Requirements:
• Thin uniform dielectric layer (5 µm?)
• Precise alignment of the two chips (bumps are 18µm diameter and minimum
50µm pitch on FE-I4 side)
Issues on “glue & press”
• Difficult to keep parallelism
• Difficult to keep calibrated spacing
(~impossible once HV-CMOS reaches
full size)
• How to align chips in XY (if capacitors
are not cantered cross-talk)
G. Darbo – INFN / Genova
HV-CMOS – FE-I4 Hybridization
Deposit Glue
FE-I4 CHIP
Apply pressure
FE-I4 CHIP
18 March 2014
2
How to improve – process steps:
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Use spacers: patterned photoresist pillars on FE-I4
Spin SU-8 photoresist (rad-hard) on FE-I4 to desired
thickness
Use mask for making pillars and clean rest of the surface
Apply glue (or SU-8 again) to have a thin layer
Apply pressure until pillars are in contact with HV2FEI4
Test done – see talk at 9th Trento WS by M. Biasotti:
http://indico.cern.ch/event/273880/session/5/contribut
ion/68/material/slides/0.pdf
The tiny HV2FEI4p1 prototype
glued on the large FE-I4
FE-I4
HV2FEI4
2.2 × 4.4 mm2
60 columns × 24rows
G. Darbo – INFN / Genova
HV-CMOS – FE-I4 Hybridization
Spin SU-8 photoresist
Pattern pillars by mask
R/O CHIP
Glue deposition
R/O CHIP
Align & pressure
DETECTOR CHIP
R/O CHIP
2x2 pillar height test:
- distance 4 mm
- height in µm
Pillar 1
5.92
Pillar 2
6.07
Pillar 3
5.92
Pillar 4
5.92
Low Tempreature Detector facility – LTD Genova
Ref.: M. Biasotti et al., 9th “Trento” Workshop – Genova 26-28/2/2014
CCPD HV-CMOS - Hybridization
18 March 2014
3
How Genova May Contribute to CCPD Hybridization
Genova has expertise and instruments
Collaboration between
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>20 years development of pixel detectors (ATLAS) and
low temperature detectors (LTD)
Process on dies (not full wafer)
We may consider to do more than gluing – look at the
combined facilities at the same department floor!
ATLAS Pixel Lab (APL)
Low Temperature Detector (LTD)
Genova Lab (see next slides)
ATLAS Pixel Lab (Genova) – APL
KLA-TENCOR P7 stylus profiler
Scan length: 150mm - 6” wafer
Repeatability/reproducibility: 4/15 Å
Vertical resolution: 0.01/0.60 Å
Manual flip-chip machine
G. Darbo – INFN / Genova
HV-CMOS – FE-I4 Hybridization
18 March 2014
4
Micro-fabrication and Thin Film Facility - Genoa LTD Lab
Laser shot for Ir, W, Re deposition
PLD film deposition
Thin Film Growth Systems
2 E-guns 4 material each @ 10-9 mbar
2 AC & 1 DC Magnetron Sputtering Systems
Pulsed Laser Deposition System @ 10-10 mbar
Micro-fabrication
Reactive Ion Etching, Plasma & Wet etching
Class1000-CR for lithography
2 Mask Aligners, Oxygen Plasma & Ion Beam
TES on SiN membrane
Critical Point Dryer
G. Darbo – INFN / Genova
HV-CMOS – FE-I4 Hybridization
18 March 2014
5
Micro-fabrication and Thin Film Facility - Genoa LTD Lab
Bolometer for 145 GHz-Back etched and
spiderweb shaped SiN membrane on Si wfr
Cryogenic Silicon Ballistic Phonon detector
for GeV cosmic protons for L2 orbit payload
10 µm
250 µm
5 µm
G. Darbo – INFN / Genova
HV-CMOS – FE-I4 Hybridization
18 March 2014
6
Next Steps
Try pillars technique on full size 2x2 cm2
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Glue face-to-face FE-I4 to FE-I4
Deposit SU-8 on FE-I4, mask off and leave columns, measure height
Glue and align second FE-I4 using manual flip-chip machine
Make sections and measure thickness
Then…
• … proceed with functional components
G. Darbo – INFN / Genova
HV-CMOS – FE-I4 Hybridization
18 March 2014
7