o
IBL per Marzio
G. Darbo - INFN / Genova
Agenda page:
G. Darbo – INFN / Genova
3D Sensor Processing - IBL
Venezia, 4 June 2009
IBL Organization
The IBL (Insertable B-Layer) is an ATLAS Upgrade project:
• It will deliver a fourth pixel layer, including a new beam-pipe, to the Inner
Detector
• When delivered, it will become a part of the Pixel Detector and of the Inner
Detector and the organization will be “absorbed” into the Pixel & ID
Pixel
Institutes
in IBL
ATLAS UPGRADE
IBL MB
(Management Board)
Module
WG
G. Darbo – INFN / Genova
Stave
WG
I&I
WG
IBL PL
IBL TC
New
Institutes
in IBL
ATLAS
UPO
IBL IB
(Institute Board)
Off-det
WG
3D Sensor Processing - IBL
IBL
Venezia, 4 June 2009
2
Management Board (MB)
Ad-interim membership
IBL Project Leader: G. Darbo
IBL Technical Coordinator: H. Pernegger
“Module” WG (2 Physicists): F. Hügging & M. GarciaSciveres
“Stave” WG (1 Phy. + 1 M.E.): O. Rohne + D. Giugni
“IBL Assembly & Installation” WG (2 M.E. initially, a Phy.
Later): N. Hartman + R. Vuillermet
“Off-detector” WG (1 Phy. + 1 E.E.): T. Flick + S. Débieux
IBL Management Board
Membership:
•IBL PL + IBL TC
•2 coordinators from each WG
•Plus “extra” members
Module WG
(2 coordinators)
•FE-I4
•Sensors
•Bump-Bonding
•Modules
•Test & QC
•Irradiation
G. Darbo – INFN / Genova
“Extra” members:
Ex officio: Upgrade Coordinator (N. Hessey), PO Chair
(M. Nessi), Pixel PL (B. Di Girolamo), ID PL (P. Wells),
Pixel Chair (C. Gößling)
Offline “liaison” Pixel Off-line coordinator: A. Andreazza
TDR editor (temporary): K. Einsweiler
Stave WG
(1 Phys + 1 Eng.)
•Staves
•Cooling Design &
Stave Thermal
Management
•HDI
•Internal Services
•Loaded Stave
•Test & QC
IBL Integr.-Install.
(2 Eng.)
•Stave Integration
•Global Sup.
•Beam Pipe (BP)
•Ext.services inst.
•IBL+BP Installation
•Cooling Plant
•Test & QC
3D Sensor Processing - IBL
Off-detector
(1 Phys + 1 E.Eng.)
•Power
•DCS
•ROD
•Opto-link
•Ext.serv.design/proc.
•Test Beam
•System Test
Venezia, 4 June 2009
3
Single Stave Layouts
Several layouts under study: 14 staves at Rmin=~3.2 cm
Turbine
Sensor
Inverted
Rail Space
Ref: N. Hartman:
•http://indico.cern.ch/conferenceDisplay.py?confId=43496
G. Darbo – INFN / Genova
3D Sensor Processing - IBL
Venezia, 4 June 2009
4
BiStave Layouts
Sensor
Biturbine
Castellated
Ref: N. Hartman:
•http://indico.cern.ch/conferenceDisplay.py?confId=43496
G. Darbo – INFN / Genova
3D Sensor Processing - IBL
Venezia, 4 June 2009
5
Frontend Chip - FE-I4
FE-I4 Status
• Prototype blocks in MPW (MOSIS) submitted 3/2008, measurements,
irradiation
• Design review (3/2009): “Design Technical Issues” on full scale design
• FE-I4 Collaboration meeting 1/7/2009
• Foreseen complete design review after Summer and submission later this
year.
New FE-I4
FE-I3
8mm
active
2.8mm
FE-I3
74%
G. Darbo – INFN / Genova
IBM reticule
Pixel size = 250 x 50 µm2
Pixels = 80 x 336
Technology = 0.13µm
Power = 0.5 W/cm2
Chartered reticule (24 x 32)
7.6mm
20.2mm
3D Sensor Processing - IBL
active
~200μm
16.8mm ~19 mm
~2mm
FE-I4
~89%
Venezia, 4 June 2009
6
FE-I4 Review & Collaboration
FE-I4 – “Design Technical Issue” Review
March 2nd , 2009 - Review agenda page:
http://indico.cern.ch/conferenceDisplay.py?confId=52403
G. Darbo – INFN / Genova
3D Sensor Processing - IBL
Venezia, 4 June 2009
7
Modules & Stave Arrangement
Two module options:
• Single chip modules abut one against the next
• Small sensor type: like 3D, active edge
W-bond pads
• Multi chip modules: chip look the same if using multi-chip modules
• As present sensor size (~2xFE-I4) : like planar n-on-n
• assuming no Z-shingling, no space.
G. Darbo – INFN / Genova
3D Sensor Processing - IBL
Venezia, 4 June 2009
8
Requirements - Fluence
Requirements discussed in previous meetings
• New simulation of n fluences as input for the IBL design (see box)
• Other requirements are:
• IBL design Peak Luminosity = 3x1034,
• Integrated Luminosity seen by IBL = 550 fb-1
• Fit made for 2 < r < 20 cm for L=1000fb-1
493 25  14
(r)   2  10
 r
r 
• Gives for IBL @ 3.7 cm (550 fb-1):

 1MeV=2.4x1015 (1.2 MGy)
• Safety factors not included in the
computation (pp event generator: 30%,
damage factor for 1 MeV fluences: 50%)
Ref. Ian Dawson - AUW
G. Darbo – INFN / Genova
3D Sensor Processing - IBL
Venezia, 4 June 2009
9
Sensors - Time line
IBL project started now:
• TDR March 2010 – sensor option not decided before
FE-I4.v1 prototyping
• FE-I4.v1 submitted (earliest) 15/10/2009 – Wafer back 31/4/2010
• FE-I4.v1 prototype modules and testing – second half 2010
Sensor decision on FE-I3 and FE-I4.v1 prototypes
• End of 2010
Sensor production and testing
• 8 months production assumed. Testing could last 4 months after end
production.
• Production starts beginning 2011.
G. Darbo – INFN / Genova
3D Sensor Processing - IBL
Venezia, 4 June 2009
10
How Many 3D Sensor Wafers
For IBL we need:
• 14 staves (+6 spares)
• 32 FE-I4 (3D sensors)
• Total need = 640 single FE-I4 tiles
= 54 Wafer
• If we consider yields:
• Sensor (0.5)
• Bump Bonding
• Module
4” Wafer – Fits 12 FE-I4
• ~ 150÷200 wafer for whole IBL
G. Darbo – INFN / Genova
3D Sensor Processing - IBL
Venezia, 4 June 2009
11
Beam-pipe - Layout
Beam-pipe radius can be reduced by at least 4mm
• On-site survey has shown that cavern floor is stable (~1mm respect 9.8mm
foreseen)
• See LEB (LHC Experimental Beam-pipes) WG – 5/3/2009:
http://indico.cern.ch/conferenceDisplay.py?confId=53606
Smaller beam-pipe  Layout options
• Better physics performance obtained with “reverse turbine” layout -sensor
facing beam-pipe – cooling redundancy (two cooling pipes) for beam-pipe
bake-out
1 mm
G. Darbo – INFN / Genova
3D Sensor Processing - IBL
Venezia, 4 June 2009
12
Material Budget
Physics performance  low material budget
• Strategy for reducing X0: carbon foam, carbon fiber (CF) cooling pipe, CO2
cooling,…
X0 - Ti cooling pipe option
X0 - CF cooling pipe option
Omega
Carbon foam
Epoxy
Sensor
R/O chips
Flex
Cooling pipe (Al)
Cooling fluid (C3F8)
0.00165
0.00179
0.00030
0.00434
0.00382
0.00144
0.00266
0.00133
Omega
Carbon foam
Epoxy
Sensor
R/O chips
Flex
Cooling pipe (CF)
Cooling fluid
0.00165
0.00179
0.00030
0.00434
0.00382
0.00144
0.00083
0.00133
General total
0.01730
General total
0.01550
Total structure
Structure+cool. Fluid
0.00640
0.00773
Total structure
Structure + cool. Fluid
0.00457
0.00590
G. Darbo – INFN / Genova
3D Sensor Processing - IBL
Venezia, 4 June 2009
13
Pixel
Strips
Inner Detector
Status – November 2008
Approved by Executive Board
EoI, Proposal presented to USG
Inner Tracker R&D
G. Darbo – INFN / Genova
3D Sensor Processing - IBL
Venezia, 4 June 2009
14
Calorimeter
Muon
Trigger, Elec, …
Status – November 2008
Approved by Executive Board
EoI, Proposal presented to USG
Calorimeter, Muon & Other R&D
G. Darbo – INFN / Genova
3D Sensor Processing - IBL
Venezia, 4 June 2009
15