Stato tracciatore
•Stato produzione moduli
•MTCC
•Stato integrazione shells e dischi
•Piano integrazione e installazione TIB/TID
•Piano complessivo integrazione + installazione
04/04/06
E.Focardi
1
Si sensors & Front-End Hybrids
HPK delivery is completed in Nov.05.
In Dec. an additional order has been placed :285 TEC, 100 sensors TOB
To be delivered by mid April.
Delivery of Hybrid production completed last December (17700).
In Dec. we have placed an additional TEC hybrid order (500 pcs)
This additional delivery has been received mid-Feb, some rework
needed on ~150 hybrids.
7.300 (114%) TEC assembled Hybrids delivered to the gantries and US
bonding centers.
Assembly of main TEC hybrid order was completed end of January.
~ 300 TEC Pitch Adapters (additional order by RMT and Planar)
have been delivered mid- Feb. PA Qualification was done and OK.
Hybrid/PA assembly of additional order is ongoing.
~ 100 already sent out. The rest (250) should go out in ~ 1 week.
04/04/06
E.Focardi
2
TIB/ID summary
TIB Weekly Module Production
4000
100.0
100% completed
3600
95.0
90.0
75% completed
2800
85.0
2400
2000
80.0
50% completed
1600
75.0
1200
25% completed
70.0
800
65.0
400
0
60.0
1 5 9 13 17 21 25 29 33 37 41 45 49 1 5 9 13 17 21 25 29 33 37 41 45 49 1 5
weeks 2004
Hybr at Gantry
weeks 2005
Mod Assem
Mod Bonded
Mod ARC Tested
weeks 2006
Mod LT Tested
Total Good
Yield
G.M.Bilei
04/04/06
E.Focardi
3
Yield %
# Modules
3200
Expected End Dates TOB modules prod.
FNAL
•
•
Will finish TOB modules when final OB1
sensors arrive
Expect to build 240 R7modules
– Est. end date: ~April 14th
•
UCSB
Will use part of April recovering some
modules
04/04/06
•
206 TEC & 507 TOB modules left to
finish
– 713 Total
•
expected end date ~April 22nd
– To get some contingency,
will increase production
rate to finish at ~April 14th
E.Focardi
4
Impegno dell’INFN nel supporto alla produzione
dei moduli TEC del tracciatore di CMS
•
•
•
•
•
•
•
•
•
Assemblaggio robotizzato di 426 moduli dei tipi Ring3 e Ring4 nella
Sezione di Bari (Gantry) dopo test di accettazione componenti
(ibrido,sensore e frame in fibra di carbonio) , con un rate max di 40
moduli alla settimana
Microsaldatura dei moduli nelle Sezioni di Bari, Catania, Padova e
Pisa
Test di funzionalita’ nei centri di microsaldatura dei moduli prodotti
Spedizione moduli ai centri di integrazione TEC dove richiesto dalla
comunita’ TEC
Inizio produzione: seconda meta’ Gennaio 06
Il 76,5 % dei moduli sono gia’ assemblati
Il 42% sono microsaldati con uno Yield del 98%
Termine assemblaggio: fine Aprile 06
Fine produzione: prima meta’ di Maggio 06
Moduli del tipo Ring4
Moduli del tipo Ring3
04/04/06
E.Focardi
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TIB in MTCC
•
•
•
•
•
•
TIB layer 3: 1 cooling loop is mounted on the CF prototype of Layer 3 structure
– 1 cooling loop = 15 strings = 45 modules = 90 fibres = 180 APVs
– Final cooling, final grounding, DOHMs etc.
TIB layer 2: 5 DS strings are mounted on ad hoc produced mockup of Layer 2
(doubled sided layer)
– 5 strings = 15 DS_modules= 30 SS_modules = 90fibres = 180 APVs
– Final cooling, final clearance
Service cylinder, cables and fibers support structure – CF prototype with final
dimensions and clearances
TIB integration @ SPiero: all the procedures were followed as close as possible to
the real TIB integration with final tooling: module integration, piping, burn-in, layer
coupling, cabling, testing etc. – good exercise for the final cabling procedure.
TIB transportation – very realistic exercise for the real TIB transportation: the
same company, tooling, procedures, monitoring, reception test etc.
TIB insertion into TOB and cabling: the same tooling, TEAM, cabling and piping
procedures.
04/04/06
E.Focardi
6
MTCC TIB burn-in @ Pisa:
NOISE distribution in Deconvolution
mode:
•some known number of dead strips
Layer 3
04/04/06
E.Focardi
7
TIB(MTCC) integration @ Pisa
MTCC TIB integration was done at S.Piero using the final cradle, insertion
machine.
Good experience, cabling procedures completely revised.
04/04/06
E.Focardi
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Transportation
0.5 g
-0.5 g
TIB MTCC was transported by the company which should transport also final TIB+ and TIB-.
The acceleration during the the transportation didn’t exceed 0.6g. Reception test at arrival
didn’t show any damage to the tracker.
Procedure ready for the final transport.
04/04/06
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TIB/TOB integration
TOB
TIB cooling
pipes (Al)
TIB Optical
connectors
TIB Optical
connectors
TOB cooling
04/04/06
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TIB/TID+ modules integration completed
(Pisa, Firenze, Torino)
Mounted objects
http://hep.fi.infn.it/CMS/Florence_integration/status.php#detail
04/04/06
L2
L4
L3
L1
D1
E.Focardi
D2 D3
11
days since January05
Integrazione TIB
• Stazione di integrazione:
-Supporto meccanico
-DAQ per controllo e lettura di almeno 1
•
•
stringa di 3 moduli
-Power Supply (LV, HV, controllo)
2 tavoli di integrazione a Pisa (S.Piero a Grado)
1 tavolo di integrazione a Firenze (Sesto
Fiorentino)+ 1 in allestimento
•Rifinitura lavori meccanici e grounding
•Montaggio Analog Opto Hybrids e stesura fibre ottiche
•Formatura dei cavi dei Digital Opto Hybrids
•Montaggio dei moduli (e test)
•Fissaggio e cablaggio dei Digital Opto Hybrids
04/04/06
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Trasporti Firenze-Pisa Torino-Pisa
• Il sistema di trasporto e’ ormai consolidato
• Gia’ trasportati a Pisa i layer 3,4,2 da Firenze
e i dischi D1,D2,D3 + da Torino
Shock absorber
04/04/06
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TIB forward: Layer 2 +1
L2
•
•
•
Alta densita’ di fibre ottiche
L2 up gia’ qualificata nel burn-in
noise e cooling tests molto buoni
L1
–Distanza ridotta tra stringhe sovrapposte
–Alta densita’ delle fibre ottiche
–Curvatura stretta dei tubicini
04/04/06
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TIB backward: componenti meccaniche
•
Layer 4
– In preparazione per
inizio integrazione
moduli (fissaggio
pillars in corso)
•
•
Layer 1
Layer 3 & 2
– Ultimato incollaggio
cooling tubes
– Previsto ulteriore test
di raffreddamento e
portata
– In corso incollaggio cooling tubes
04/04/06
E.Focardi
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Dischi Interni
Ring 2
Ring 3 Ring 1
04/04/06
E.Focardi
Disco ultimato a Torino e pronto per il transporto
16
Integrazione Anelli
OPERAZIONI:
• montaggio servizi
MC,DOM,AHO,Tprobe,p.ext.
• Montaggio moduli
• Test
OTTIMIZZAZIONI:
•
•
•
04/04/06
Integrazione elettronica digitale
Passaggio fibre
Grounding
E.Focardi
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Test inserimento disco sul service cylinder
E’ stato fatto un test di inserimento di un disco nudo nel
service cylinder utilizzando il jig di allineamento disco04/04/06
E.Focardi
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cilindro
The climatic chamber
•
A large cold room (~27 m3) has been
installed in Pisa to perform the burnin of the assembled layers/disks of
the TIB and TID. The room has a
communication door directly into the
clean room where the module
integration is performed.
•
The final configuration will allow to
test up to ¼ Layer-2 and a ½ Layer-4
(half end).
•
The room can be operated from 30oC to +80oC and conditioned with
dry air. Operations are controlled by
a a dedicated PC.
•
Feed troughs allow the routing of the
cables from the cold room with the
outside and the clean room.
04/04/06
•
E.Focardi
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Setup
•
•DAQ
–1 FEC-VME (8 channels, 4 in use)
–8 FED9U
Hardware
– Power supply:
• SY1527
• 3 crates
• 22 CAEN PSM
–
–
18 4601H
4 4601F
• 2 channels 48 Volt CAEN
• + custom GUI + monitoring
– Cables
TK TSC
• 44 LIC
• 8 CAB60 cables
TK TFB
– Chiller
FED
FED
FED
FED
• Up to 7.5 bar freon
04/04/06
E.Focardi
VME
VME
VME
VME
Data
v2
FECVME
v2
v2
v2
TTCvx TTCv
xTK front end detectors
20
Pre-test operations
Disk fiber holder
Ribbons
Cables
•
Sizeable fraction of the time spent to prepare the
structure
– Disks and Layers 3 & 4 two days work
– layer 2 fibers connected in 2 weeks (~2
•
cooling
people with Christmas holidays duty cycle...)
All connections logged in integration DB and used for run
analysis.
04/04/06
E.Focardi
21
Scenario
• The burn-in protocol guarantees:
– At least 30 hours powered, clocked and triggered, of
which 10 hours cold
– 6 hours run under CMS conditions (chamber –10C,
liquid –25C, bias 400 V) to study stability, reading
temperatures, pedestals, noise
• Layers tested so far have been tested much longer (5
cycles, 100 hours integrated).
Power supply parameters logged continuously
I2.5(A)
48 APV
36 APV
04/04/06
Time (hours)
Monitoring of
•cooling loops temperatures
•chiller pressure
E.Focardi
22
Performed tests
• Control ring and I2C device scan
– read-write test
– redundancy
– at two different temperatures
• warm (room 10C, C6F14 0C)
• cold (room -10C, C6F14 -25C)
– not responding modules are
replaced
• Thermal response
– module temperatures
measured at two working
point (APV on and
operational):
• room -10C , C6F14 -10C
• room -10C , C6F14 -25C
• Channel Readout: full sequence of
tuning runs:
– Connection
• all the modules has to be
found
– Timing scan
– Opto-gain scan
– Timing scan (FED
thresholds)
– VPSP scan (APV settings)
– Pedestal/Noise runs
• Peak and Deco mode
• HV @ 400 V
– tuning repeated when
temperature is changed
–04/04/06
Differences used to study E.Focardi• DAQ system runs smoothly
thermal contact
23
Activities summary
Cold room status
Before:
TIB+ layer3 UP:
NOW:
TIB+ layer3 UP:
pre-reworking
TIB+ layer3 DW:
only I2C test
TIB+ layer4 DW: TIB+ layer4 UP:
TID+ disk1:
TIB+ Layer 2 UP:
SS modules only
20 PSU, 4 DOHM
318 fibers, 4 FED
DS modules
26 PSU, 6 DOHM
368 fibers, 5 FED
DS modules
42 PSU, 8 DOHM
630 fibers, 8 FED
•
SS modules only
20 PSU, 4 DOHM
318 fibers, 4 FED
MTCC:
DS modules
11 PSU, 2 DOHM
180 fibers, 2 FED
Number channels doubled since midDecember:
– more than 160k strips in layer 2 UP
04/04/06
E.Focardi
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Tested structures
•
TIB+ L3 UP:
•
– no cooling loop test
– reworking done after the test
TIB+ L4 DOWN:
• TIB+ L3 DOWN:
– from Feb 3 to Feb 6
– from Oct 20 to Nov 14
•
• cooling loop tested individually
TIB+ L4 UP:
– from Nov 15 to Dec 1
•
TID+ disk 1 (3 rings)
– from Dec 17 to Dec 23
•
• cooling loops ring 3 to be fixed
TIB+ L2 UP
– from Dec 27 to Jan 26
•
• I2C cold test only to spot
modules to be replaced
before reworking
• TIB+ L3 UP (is back...):
– Feb 7 to Mar 29
• Tests on new grounding
scheme
• Disk 2 (3 rings)
• Mar 30 – April 6 (?)
• Future Plans:
– TIB+ L3 DOWN
– TIB+ L2 DOWN
MTCC structure (L3+L2)
– from Jan 27 to Feb 2
• no cold test
04/04/06
E.Focardi
• (both already cabled)
25
Thermal
• All DCU temperatures read out
during data taking at nominal
flow
Coolant @-25C
Sensor temperature
Sensor Temperatur e  (- 19.53  1.64)C
Hybrid Temperatur e  (- 18.00  1.23)C
To be compared with single module
measurements of
– Sensor -20.4 °C
– Hybrid -17.8 °C
• Hence expect that the maximum
sensor temperature at end-of-life
would not exceed
~16°C
04/04/06
Hybrid temperature
E.Focardi
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Disco 1 : temp sensori a silicio
04/04/06
E.Focardi
Silicon @-14C for DS modules, @-17C for SS modules
27
Disco 1 : temp ibridi
Ibridi Scollati :tipicamente 300 m
04/04/06
E.Focardi
Good hybrids @-6C for DS modules, @-13C for SS modules
28
Results: TID+ disk1
forward
backward
ring 3
•
Temperature pattern in the other
strings is being compared with
expectation
• Problem serious enough to stop
burn-in and wait for reparation
to redo it
sensors
hybrids
•
•
Problems in both forward strings of
ring3: poor cooling liquid flux in
those strings
Confirmed by:
– direct temp measurements
– retrieving cooling loop test
04/04/06
data
E.Focardi
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Timing scan
ADC
Step 1) all modules should be time aligned
Synchronization pulses (tick-marks) from each modules are sampled
by the FED and reconstructed in time with different delays.
•
All (~258 ) tick marks are reconstructed and
aligned
•
All modules delayed to compensate the delay in
the time arrival of trigger on the module
consistent with logical position in the ring
Opto gain
First position in the ring
04/04/06
Last position in the ring
E.Focardi
30
Grounding studies
Low
High
Noise RMS
String number
04/04/06
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31
Summary of results
Peak L4
04/04/06
Deconvolution L4
E.Focardi
32
Noise run results: TIB+ L2 UP
peak
warm
peak
cold
•
TIB+ L2 UP strip
noise distribution
–
deco
warm
04/04/06
deco
cold
E.Focardi
after CM subtr.
•
Normalized to have
a tick-mark
height=640 counts
•
Strips statistics: out
of 161280:
–
–
•
~100-180 noisy
~75-110 dead
~1.5-2 per mil of
bad strips !
33
Tracking Integration Facility
04/04/06
E.Focardi
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TST in the TIF
04/04/06
E.Focardi
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TOB Rod insertion
04/04/06
E.Focardi
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169 petals assembled
148 tested
TEC
TEC- @TIF
04/04/06
E.Focardi
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TEC status
18 15 2
6
04/04/06
Cosmic muon in TEC+, reconstructed in ORCA
E.Focardi
(23.3.06)
38
Forward Pixel test
04/04/06
E.Focardi
39
Forward pixel, Milano
•
Impegni
1.
2.
3.
4.
•
Organizzazione e responsabilita’ dei test su fascio dei fwd pixel
Sviluppo e responsabilita’ del software per il test-stand per la
fase di produzione dei fwd pixel
Sviluppo e responsabilita’ del programma di allineamento dei
fwd pixel
In prospettiva, partecipazione al commissioning dei fwd pixel
Beam test
–
Abbiamo appena concluso (Febbraio ’06) un primo run dei
rivelatori irraggiati a 3  1013
•
–
I risultati dimostrano che I rivelatori funzionano in modo
pressocche’ perfetto e non manifestano alcun segno di degrado a
3  1013
•
–
Gli stessi rivelatori, non irraggiati, erano stati provati su fascio lo
scorso Luglio
Si tratta del primo test su fascio dei nuovi chip di lettura condotto
con un sistema di tracciamento ad alta risoluzione
Il set up utilizzato e’ quello di BTeV da noi opportunamente
adattato
04/04/06 •
Per ulteriori dettagli vedi E.Focardi
presentazione Luigi alla pagina
http://indico.cern.ch/conferenceDisplay.py?confId=a061628
40
Progressi
• Pixel Test-Stand
– Il software, DAQ e relativi programmi di analisi, e’ praticamente completo
– Si sta ora lavorando sull’interfacciamento al DB
– Principali caratteristiche del sistema sono
• L’alto grado di interattivita’ nell’eseguire la diagnosi completa dei rivelatori
• Brevissimi tempi di esecuzione grazie all’utilizzo di microprogrammi su FPGA
http://docdb.fnal.gov/CMS-public/DocDB/ListBy?authorid=27
•
Allineamento Pixel
– Preso possesso dei vari programmi sviluppati
– Si sta ora cercando di capirne le prestazioni e I limiti utilizzando I mezzi di
calcolo dello CNAF (Pedrini)
– http://indico.cern.ch/conferenceDisplay.py?confId=a058113
•
contributo allo sviluppo del software di tracciamento:
– Terminato il porting del pacchetto di Kalman filter in CMSSW,
– si e’in ora in fase di begug & validation
vedi ad es presentazioni Stefano/Marco/Giuseppe
http://indico.cern.ch/conferenceDisplay.py?confId=a06913
04/04/06
E.Focardi
41
Off detector electronics
04/04/06
E.Focardi
42
Power System Components Delivery Status
820/1000
400/1000
A4601H PSMs modules already delivered,
end by summer ‘06
Back Boards delivered, end by fall ‘06
80/130
Easy 4000 crates delivered, end by summer ‘06
1/90
3/60
A4602 PSMs for the controls: first proto
delivered, production by fall ‘06
A3486 Ac/Dc (48 Volts) delivered, end fall ‘06
22/22
A1676 Branch controller delivered
2/2
SY1527 delivered
Cables
Al cables and short control cables : received @Cern ~100/650
LIC production assigned:a sample of 2 Km are expected in April
04/04/06
- 25% produced by mid July, E.Focardi
production completed by Fall
43
L4 sub-assembly
04/04/06
E.Focardi
Insertion jig@work 44
!
Test after final assembly
We have checked the possibility to perform a final test of the
TIB/TID+ fully assembled before transport.
The entire cradle fits into the cold-room. Possibility to
anticipate in Pisa the tests foreseen at TIF (hunt for
unforeseen problems in the final assembly; possibility to
operate in cold the entire TIB/TID; sort of pre-commissioning
of TIB/TID+).
The drawback is the time: 3 additional weeks are needed.
The integration/burn-in team strongly supports the proposal.
No impact on the overall schedule, backward part integration
04/04/06 on April 3-rd.
E.Focardi
45
started
Status and plans
1. The integration of the modules on the TIB/TID+ is done.
2. The sub-assembly has successfully started (L4).
3. With pre-commissioning in the cold room in Pisa
we shall transport TIB/TID+ to CERN in May.
4. The module integration on the TIB/TID- part started at the
beginning of April (5 integration teams in parallel).
5. We plan to transport TIB/TID- to CERN by August.
04/04/06
E.Focardi
46
v34.4 :best projection from current position
Magnet test over:
early Aug 06
Central wheel
ready to lower:
late Oct 06
Tracker installation:
Feb 07
CMS "ready to close"
end Jul 07
04/04/06
E.Focardi
Re-optimised:
ECAL, Preshower,
Tracker Installation
47
plus YB lowering.
Integration, electronics & commissioning
04/04/06
E.Focardi
48
Milestones for Siliconstrip
Completion of TIB / TID+ Integration in Italy
May-06
Completion of TOB Modules
May-06
Magnet Test System at P5 commissioned
May-06
Completion of TEC Modules
Jun-06
Completion of TIB / TID- Integration in Italy
Aug-06
Completion of TOB RODs
Aug-06
Completion of the Integration of TOB+
Aug-06
Completion of TEC Petals
Sep-06
Completion of the Integration of TEC+ in Aachen
Sep-06
Completion of the Integration of TOB-
Oct-06
Completion of the Integration of TEC- at CERN
Nov-06
TRACKER READY FOR TRANSPORT TO P5
Jan-07
04/04/06
E.Focardi
49
Milestones for pixels
Forward Pixels
Completion of a full production blade
Jul-06
Completion of the first production half ring
Dec-06
Completion of full FPIX readout chain system test
Dec-06
Barrel Pixels
System test of complete BPIX module group with supply tube Jul-06
and final powering
1/3 of modules for layer 1 & 2 fabricated & tested
Sep-06
2/3 of modules for layer 1 & 2 fabricated & tested
Nov-06
Supply tubes & mechanics for commissioning system
delivered to PSI
Dec-06
04/04/06
E.Focardi
50